Publication detail

Mechanical properties of plasma-polymerized tetravinylsilane films

ČECH, V. HOSEIN, H.-A. LASOTA, T. DRZAL, L.

Original Title

Type

journal article - other

Language

English

Original Abstract

Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma-polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Youngs modulus and hardness as a function of the indenter displacement (5-500 nm) were investigated for films of 1-micron thickness. The Youngs modulus (hardness) was observed to increase from 8.3 GPa (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic-plastic material.

Keywords

mechanical properties; nanoindentation; organosilicon precursors; plasma-enhanced chemical vapor deposition (PECVD); thin films

Authors

ČECH, V.; HOSEIN, H.-A.; LASOTA, T.; DRZAL, L.

RIV year

2011

Released

31. 12. 2011

ISBN

1612-8850

Periodical

Plasma Processes and Polymers

Year of study

Number

State

Federal Republic of Germany

Pages from

138

Pages to

146

Pages count

BibTex

@article{BUT89392,
  author="ČECH, V. and HOSEIN, H.-A. and LASOTA, T. and DRZAL, L.",
  title="Mechanical properties of plasma-polymerized tetravinylsilane films",
  journal="Plasma Processes and Polymers",
  year="2011",
  volume="8",
  number="2",
  pages="138--146",
  issn="1612-8850"
}