Detail publikace

Mechanical properties of plasma-polymerized tetravinylsilane films

ČECH, V. HOSEIN, H.-A. LASOTA, T. DRZAL, L.

Originální název

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma-polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Youngs modulus and hardness as a function of the indenter displacement (5-500 nm) were investigated for films of 1-micron thickness. The Youngs modulus (hardness) was observed to increase from 8.3 GPa (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic-plastic material.

Klíčová slova

mechanical properties; nanoindentation; organosilicon precursors; plasma-enhanced chemical vapor deposition (PECVD); thin films

Autoři

ČECH, V.; HOSEIN, H.-A.; LASOTA, T.; DRZAL, L.

Rok RIV

2011

Vydáno

31. 12. 2011

ISSN

1612-8850

Periodikum

Plasma Processes and Polymers

Ročník

Číslo

Stát

Spolková republika Německo

Strany od

138

Strany do

146

Strany počet

BibTex

@article{BUT89392,
  author="ČECH, V. and HOSEIN, H.-A. and LASOTA, T. and DRZAL, L.",
  title="Mechanical properties of plasma-polymerized tetravinylsilane films",
  journal="Plasma Processes and Polymers",
  year="2011",
  volume="8",
  number="2",
  pages="138--146",
  issn="1612-8850"
}