Publication detail

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

TRIVEDI, R. ČECH, V.

Original Title

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

Type

abstract

Language

English

Original Abstract

A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using the conventional depth-sensing nanoindentation technique as well as the load-partial-unload (cyclic) nanoindentation technique. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

Keywords

plasma polymerization; thin films; nanoindentation

Authors

TRIVEDI, R.; ČECH, V.

Released

22. 12. 2009

Pages from

1

Pages to

1

Pages count

1

BibTex

@misc{BUT60907,
  author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
  booktitle="Book of Abstracts, 7th AEPSE 2009, Busan",
  year="2009",
  pages="1--1",
  note="abstract"
}