Detail publikace

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

TRIVEDI, R. ČECH, V.

Originální název

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

Typ

abstrakt

Jazyk

angličtina

Originální abstrakt

A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using the conventional depth-sensing nanoindentation technique as well as the load-partial-unload (cyclic) nanoindentation technique. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

Klíčová slova

plasma polymerization; thin films; nanoindentation

Autoři

TRIVEDI, R.; ČECH, V.

Vydáno

22. 12. 2009

Strany od

1

Strany do

1

Strany počet

1

BibTex

@misc{BUT60907,
  author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
  booktitle="Book of Abstracts, 7th AEPSE 2009, Busan",
  year="2009",
  pages="1--1",
  note="abstract"
}