Publication detail

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

TRIVEDI, R. ČECH, V.

Original Title

Type

journal article - other

Language

English

Original Abstract

A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

Keywords

plasma polymerization; thin films; nanoindentation

Authors

TRIVEDI, R.; ČECH, V.

RIV year

2010

Released

27. 12. 2010

ISBN

0257-8972

Periodical

Surface and Coatings Technology

Year of study

205

Number

Suppl 1

State

Swiss Confederation

Pages from

286

Pages to

289

Pages count

BibTex

@article{BUT50758,
  author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
  journal="Surface and Coatings Technology",
  year="2010",
  volume="205",
  number="Suppl 1",
  pages="286--289",
  issn="0257-8972"
}