Detail publikace
Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
TRIVEDI, R. ČECH, V.
Originální název
Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques
Typ
článek v časopise - ostatní, Jost
Jazyk
angličtina
Originální abstrakt
A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.
Klíčová slova
plasma polymerization; thin films; nanoindentation
Autoři
TRIVEDI, R.; ČECH, V.
Rok RIV
2010
Vydáno
27. 12. 2010
ISSN
0257-8972
Periodikum
Surface and Coatings Technology
Ročník
205
Číslo
Suppl 1
Stát
Švýcarská konfederace
Strany od
286
Strany do
289
Strany počet
4
BibTex
@article{BUT50758,
author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
journal="Surface and Coatings Technology",
year="2010",
volume="205",
number="Suppl 1",
pages="286--289",
issn="0257-8972"
}