Publication detail

Utilization of Williams‘ power series for etimation of crack behavior under mixed-mode loading

MALÍKOVÁ, L. MIARKA, P. ŠIMONOVÁ, H.

Original Title

Type

conference paper

Language

English

Original Abstract

Multi-parameter fracture mechanics concept has been applied to investigate crack behavior under mixed-mode loading, particularly in a semi-circular bending disc. The so-called Williams’ series expansion is used for the crack-tip stress field approximation. It has been shown that application of the generalized fracture mechanics concept can be crucial for materials with specific fracture behavior, such as elastic-plastic or quasi-brittle one, when fracture occurs not only in the very vicinity of the crack tip, but also in a more distant surrounding. Then, considering the higher-order terms of the Williams’ expansion in fracture criteria can be helpful. The attention is devoted to the analysis of the influence of various distances between the supports during the three-point bending test on the results of the further crack propagation direction.

Keywords

Crack-tip field; Semi-circular disc under bending; Finite element analysis; Crack behaviour; Mixed-mode; Williams’ expansion

Authors

MALÍKOVÁ, L.; MIARKA, P.; ŠIMONOVÁ, H.

Released

8. 1. 2020

Publisher

Trans Tech Publications Ltd.

Location

Switzerland

ISBN

978-3-0357-1586-6

Book

Advances in Fracture and Damage Mechanics XVIII

ISBN

1013-9826

Periodical

Key Engineering Materials (print)

Year of study

827

State

Swiss Confederation

Pages from

203

Pages to

208

Pages count

BibTex

@inproceedings{BUT161337,
  author="Lucie {Malíková} and Petr {Miarka} and Hana {Šimonová}",
  title="Utilization of Williams‘ power series for etimation of crack behavior under mixed-mode loading",
  booktitle="Advances in Fracture and Damage Mechanics XVIII",
  year="2020",
  journal="Key Engineering Materials (print)",
  volume="827",
  pages="203--208",
  publisher="Trans Tech Publications Ltd.",
  address="Switzerland",
  doi="10.4028/www.scientific.net/KEM.827.203",
  isbn="978-3-0357-1586-6",
  issn="1013-9826"
}