Detail publikace

Utilization of Williams‘ power series for etimation of crack behavior under mixed-mode loading

MALÍKOVÁ, L. MIARKA, P. ŠIMONOVÁ, H.

Originální název

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Multi-parameter fracture mechanics concept has been applied to investigate crack behavior under mixed-mode loading, particularly in a semi-circular bending disc. The so-called Williams’ series expansion is used for the crack-tip stress field approximation. It has been shown that application of the generalized fracture mechanics concept can be crucial for materials with specific fracture behavior, such as elastic-plastic or quasi-brittle one, when fracture occurs not only in the very vicinity of the crack tip, but also in a more distant surrounding. Then, considering the higher-order terms of the Williams’ expansion in fracture criteria can be helpful. The attention is devoted to the analysis of the influence of various distances between the supports during the three-point bending test on the results of the further crack propagation direction.

Klíčová slova

Crack-tip field; Semi-circular disc under bending; Finite element analysis; Crack behaviour; Mixed-mode; Williams’ expansion

Autoři

MALÍKOVÁ, L.; MIARKA, P.; ŠIMONOVÁ, H.

Vydáno

8. 1. 2020

Nakladatel

Trans Tech Publications Ltd.

Místo

Switzerland

ISBN

978-3-0357-1586-6

Kniha

Advances in Fracture and Damage Mechanics XVIII

ISSN

1013-9826

Periodikum

Key Engineering Materials (print)

Ročník

827

Stát

Švýcarská konfederace

Strany od

203

Strany do

208

Strany počet

BibTex

@inproceedings{BUT161337,
  author="Lucie {Malíková} and Petr {Miarka} and Hana {Šimonová}",
  title="Utilization of Williams‘ power series for etimation of crack behavior under mixed-mode loading",
  booktitle="Advances in Fracture and Damage Mechanics XVIII",
  year="2020",
  journal="Key Engineering Materials (print)",
  volume="827",
  pages="203--208",
  publisher="Trans Tech Publications Ltd.",
  address="Switzerland",
  doi="10.4028/www.scientific.net/KEM.827.203",
  isbn="978-3-0357-1586-6",
  issn="1013-9826"
}