Publication detail

Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation

TRIVEDI, R. HOFEREK, L. ČECH, V.

Original Title

Type

journal article - other

Language

English

Original Abstract

Plasma-polymerized tetravinylsilane films deposited on silicon wafers by PECVD at different powers using pulsed plasma were analyzed by both typical conventional depth sensing and by cyclic nanoindentation. A comparative study of the two methods was carried out under reduced system drift. It was found that cyclic nanoindentation is a reproducible technique enabling reliable construction of the depth profile of mechanical properties to the same degree of accuracy as conventional nanoindentation but considerably faster. The Youngs modulus (7.9-17 GPa) and hardness (0.69-3.0 GPa) of films were controlled by the effective power (0.1-10 W). Conditions for appropriate depth analysis of mechanical properties at shallow depth and the limited applicability of the 10% rule are also discussed.

Keywords

Thin film, plasma polymerization, nanoindentation, Youngs modulus, hardness

Authors

TRIVEDI, R.; HOFEREK, L.; ČECH, V.

RIV year

2011

Released

31. 12. 2011

ISBN

0257-8972

Periodical

Surface and Coatings Technology

Year of study

205

Number

State

Swiss Confederation

Pages from

470

Pages to

474

Pages count

BibTex

@article{BUT89393,
  author="Rutul Rajendra {Trivedi} and Lukáš {Hoferek} and Vladimír {Čech}",
  title="Depth profile of mechanical properties of plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation",
  journal="Surface and Coatings Technology",
  year="2011",
  volume="205",
  number="S2",
  pages="470--474",
  issn="0257-8972"
}