Publication detail
Anisotropic film construction using plasma nanotechnology (atomic polymerization)
HOFEREK, L. TRIVEDI, R. MISTRÍK, J. ČECH, V.
Original Title
Anisotropic film construction using plasma nanotechnology (atomic polymerization)
Type
abstract
Language
English
Original Abstract
Bilayers consisting of a-SiC:H and a-SiOC:H alloys were deposited on silicon wafer using plasma-enhanced chemical vapor deposition (PECVD). The layered structures were subjected to ellipsometric measurements that enabled us to distinguish individual layers and determine the layer thickness and its optical constants. In next study, single layer and multilayered a-SiC:H films, deposited from tetravinylsilane at different powers by PECVD, were investigated intensively by spectroscopic ellipsometry, nanoindentation, and atomic force microscopy (AFM) to compare optical and mechanical properties of the individual layer of decreased thickness (315 - 25 nm) with those of the corresponding single layer.
Keywords
plasma polymerization, thin films
Authors
HOFEREK, L.; TRIVEDI, R.; MISTRÍK, J.; ČECH, V.
Released
27. 12. 2010
Pages from
1
Pages to
2
Pages count
2
BibTex
@misc{BUT60975,
author="Lukáš {Hoferek} and Rutul Rajendra {Trivedi} and Jan {Mistrík} and Vladimír {Čech}",
title="Anisotropic film construction using plasma nanotechnology (atomic polymerization)",
booktitle="IC-Plants 2010",
year="2010",
edition="1",
pages="1--2",
note="abstract"
}