Publication detail

Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates

ŠEVEČEK, O. BERMEJO, R. PROFANT, T. KOTOUL, M.

Original Title

Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates

Type

conference paper

Language

English

Original Abstract

The influence of the compressive residual stresses and layer thickness in ceramic laminates on the presence of the crack bifurcation phenomenon is numerically investigated in this contribution. Using the fracture criterion, based on the Finite Fracture Mechanics, the angle and type of crack propagation (single crack deflection/bifurcation) within the layers with large compressive stresses is investigated. Laminates with various thicknesses of the compressive layer and constant level of the compressive residual stresses are used for this purpose. In these cases, the level of the T-stress (in the vicinity of the crack tip) can play a role as a second parameter in the fracture criterion (next to the stress intensity factor) and as a consequence can this term influence the predicted crack propagation behaviour.

Keywords

Ceramic laminates;T-stress; crack bifurcation; Finite Fracture Mechanics

Authors

ŠEVEČEK, O.; BERMEJO, R.; PROFANT, T.; KOTOUL, M.

RIV year

2014

Released

1. 7. 2014

Publisher

Elsevier

Location

Trondheim, Norsko

ISBN

9781632669094

Book

20th European Conference on Fracture (ECF 2014)

Edition

Procedia Materials Science Volume 3

Edition number

1

ISBN

2211-8128

Periodical

Procedia Materials Science

Year of study

3

Number

7

State

Kingdom of the Netherlands

Pages from

1062

Pages to

1067

Pages count

6

BibTex

@inproceedings{BUT108414,
  author="Oldřich {Ševeček} and Raul {Bermejo} and Tomáš {Profant} and Michal {Kotoul}",
  title="Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates",
  booktitle="20th European Conference on Fracture (ECF 2014)",
  year="2014",
  series="Procedia Materials Science Volume 3",
  journal="Procedia Materials Science",
  volume="3",
  number="7",
  pages="1062--1067",
  publisher="Elsevier",
  address="Trondheim, Norsko",
  doi="10.1016/j.mspro.2014.06.173",
  isbn="9781632669094",
  issn="2211-8128"
}