Detail publikace

Mechanical properties of plasma polymer films controlled by RF power

PÁLESCH, E. KONTÁROVÁ, S. ČECH, V.

Originální název

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This study deals with plasma polymer films deposited on silicon substrates using tetravinylsilane monomer. The deposition technique was plasma-enhanced chemical vapour deposition. Nanoindentation was used as a method to investigate mechanical properties of samples prepared at different RF powers. The Youngs modulus and hardness of thin films were estimated from load-displacement curves. The nanoscratch test was employed to determine the critical normal load needed for film delamination, as a parameter describing adhesion to the substrate. AFM images of scratches were carried out to correlate the data with nature and shape of scratches.

Klíčová slova

Thin films, plasma polymer, mechanical properties, nanoindentation, nanoscratch test

Autoři

PÁLESCH, E.; KONTÁROVÁ, S.; ČECH, V.

Vydáno

17. 12. 2012

Strany od

Strany do

Strany počet

BibTex

@inproceedings{BUT97296,
  author="Erik {Pálesch} and Soňa {Kontárová} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer films controlled by RF power",
  booktitle="Proc. 13th Int. Conf. Plasma Surface Engineering",
  year="2012",
  pages="1--4"
}