Detail publikace
RF-power-controlled Young's modulus of plasma-polymerized organosilicon films
ČECH, V. VANĚK, J. JONES, F. GORUPPA, A.
Originální název
RF-power-controlled Young's modulus of plasma-polymerized organosilicon films
Typ
článek v časopise - ostatní, Jost
Jazyk
angličtina
Originální abstrakt
Elastic thin films of vinyltriethoxysilane were prepared by plasma-enhanced chemical vapor deposition using an RF (13.56 MHz) helical coupling plasma system. An effective power density ranging from 8 . 10-4 to 0.3 W cm-3 was used to control the Young's modulus of films to a range of 3.7 - 11.3 GPa. The modulus decreased slightly with the film thickness varying from 80 nm to 1.5 microns for films prepared under the same deposition conditions. The hardness of films (0.7 - 2.1 GPa) was proportional to the Young's modulus with a relatively high ratio of 0.185 associated with a higher mean compressive elastic strain with respect to other groups of plasma polymers (0.059 - 0.115). Thin films exhibited an abrupt increase in hardness at the film surface related to post-deposition oxidation.
Klíčová slova
CVD; thin film; nanoindentation; mechanical properties; organosilicon
Autoři
ČECH, V.; VANĚK, J.; JONES, F.; GORUPPA, A.
Rok RIV
2005
Vydáno
1. 10. 2005
Nakladatel
Springer
ISSN
0022-2461
Periodikum
Journal of Materials Science
Ročník
40
Číslo
18
Stát
Spojené státy americké
Strany od
5099
Strany do
5102
Strany počet
4
BibTex
@article{BUT46352,
author="Vladimír {Čech} and Jan {Vaněk} and Frank {Jones} and Alexander {Goruppa}",
title="RF-power-controlled Young's modulus of plasma-polymerized organosilicon films",
journal="Journal of Materials Science",
year="2005",
volume="40",
number="18",
pages="5099--5102",
issn="0022-2461"
}