Detail publikace

Serial Resistance Effect on Organic Electrochemical Transistors Transconductance

MARKOVÁ, A. STŘÍTESKÝ, S. WEITER, M. VALA, M.

Originální název

Serial Resistance Effect on Organic Electrochemical Transistors Transconductance

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

Organic electrochemical transistors (OECTs) with variable electrode resistance and channel conductivity were studied. The effect of parasitic serial resistance on OECT function, especially transconductance, was evaluated. It was shown that due to the nonoptimized serial resistance, the transistors can have a transconductance lower by tens of percentage compared to the theoretical intrinsic transconductance. We show here that by simply reducing the contacts' resistance, it is possible to prepare a planar OECT with a high transconductance of 108 mS, which is close to the intrinsic transconductance of 121 mS. These values represent some of the highest ones reported so far, despite the fact that the poly(3,4-ethylenedioxythiophene) doped with poly(styrene sulfonate) (PEDOT:PSS) used here has a lower conductivity.

Klíčová slova

Bioelectronics; organic electrochemical transistor (OECT); poly(3,4-ethylenedioxythiophene) doped with poly(styrene sulfonate) (PEDOT:PSS); serial resistance; transconductance

Autoři

MARKOVÁ, A.; STŘÍTESKÝ, S.; WEITER, M.; VALA, M.

Vydáno

24. 7. 2023

Nakladatel

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Místo

PISCATAWAY

ISSN

1530-437X

Periodikum

IEEE SENSORS JOURNAL

Ročník

23

Číslo

17

Stát

Spojené státy americké

Strany od

19417

Strany do

19423

Strany počet

7

URL

BibTex

@article{BUT184414,
  author="Aneta {Marková} and Stanislav {Stříteský} and Martin {Weiter} and Martin {Vala}",
  title="Serial Resistance Effect on Organic Electrochemical Transistors Transconductance",
  journal="IEEE SENSORS JOURNAL",
  year="2023",
  volume="23",
  number="17",
  pages="7",
  doi="10.1109/JSEN.2023.3296939",
  issn="1530-437X",
  url="https://ieeexplore.ieee.org/document/10192544"
}