Detail publikace

Elastic Modulus and Hardness of Plasma-Polymerized Organosilicones Evaluated by Nanoindentation Techniques

ČECH, V. LUKEŠ, J. PÁLESCH, E. LASOTA, T.

Originální název

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

Nanoindentation techniques are today a standard tool for the characterization of mechanical properties of thin films at nanoscale. In this feature article, we introduce various techniques, together with their applications for plasma-polymerized organosilicones: starting from conventional instrumented nanoindentation, followed by continuous oscillatory loading and cyclic nanoindentation by partial unloading for assessing the depth profile of mechanical properties, to continuous mechanical mapping over the sample surface. Methods of analyzing and interpreting the measured data are presented to determine the elastic modulus and hardness of tested films. Plasma polymer films are materials of viscoelastic or elastic-plastic behavior; the correct technique must therefore be selected to give the most accurate mechanical property measurements. This study reveals that the mechanical properties of plasma-polymerized organosilicones are determined by the level of network cross-linking and that network density may be controlled by deposition conditions. The elastic modulus and hardness ranging from 13.3 GPa (0.1 W) to 122 GPa (150 W) and from 1.93 to 14.6 GPa, respectively, are controlled by the effective power if tetravinylsilane monomer is used for PECVD. Nanoindentation techniques are suitable for investigation not only of single layers but also of multilayer films, if cross-sectioned samples are used. A number of limitations of the techniques are also discussed. Further, model simulations are helpful to correctly interpret the nanoindentation data using finite element analysis. Model simulations suggest that the surface topography of the specimen has a crucial influence on nanoindentation measurements. A list of conditions for successful analysis of mechanical properties is included.

Klíčová slova

elastic modulus; hardness; nanoindentation; plasma polymerization; plasma-enhanced chemical vapor deposition (PECVD); thin films

Autoři

ČECH, V.; LUKEŠ, J.; PÁLESCH, E.; LASOTA, T.

Rok RIV

2015

Vydáno

30. 9. 2015

ISSN

1612-8850

Periodikum

Plasma Processes and Polymers

Ročník

Číslo

Stát

Spolková republika Německo

Strany od

864

Strany do

881

Strany počet

URL

http://onlinelibrary.wiley.com/doi/10.1002/ppap.201500036/abstract?campaign=woletoc

BibTex

@article{BUT117295,
  author="Vladimír {Čech} and Jaroslav {Lukeš} and Erik {Pálesch} and Tomáš {Lasota}",
  title="Elastic Modulus and Hardness of Plasma-Polymerized Organosilicones Evaluated by Nanoindentation Techniques",
  journal="Plasma Processes and Polymers",
  year="2015",
  volume="12",
  number="9",
  pages="864--881",
  doi="10.1002/ppap.201500036",
  issn="1612-8850",
  url="http://onlinelibrary.wiley.com/doi/10.1002/ppap.201500036/abstract?campaign=woletoc"
}