Detail publikace

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

BOCCACCINI, D. ŠEVEČEK, O. et al.

Originální název

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.

Klíčová slova

Schwickerath crack-initiation test; three-point bending test; SOC interfaces; metal-ceramic bond strength

Autoři

BOCCACCINI, D.; ŠEVEČEK, O. et al.

Vydáno

1. 1. 2016

Nakladatel

Elsevier

Místo

Holandsko

ISSN

0167-577X

Periodikum

MATERIALS LETTERS

Ročník

2015

Číslo

162

Stát

Nizozemsko

Strany od

250

Strany do

253

Strany počet

URL

http://www.sciencedirect.com/science/article/pii/S0167577X15303293

BibTex

@article{BUT116748,
  author="D. N. {Boccaccini} and Oldřich {Ševeček}",
  title="Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces",
  journal="MATERIALS LETTERS",
  year="2016",
  volume="2015",
  number="162",
  pages="250--253",
  doi="10.1016/j.matlet.2015.07.137",
  issn="0167-577X",
  url="http://www.sciencedirect.com/science/article/pii/S0167577X15303293"
}