Detail publikačního výsledku

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

ŠTUMPF, M.

Originální název

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

Anglický název

The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits

Druh

Článek WoS

Originální abstrakt

The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.

Anglický abstrakt

The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.

Klíčová slova

printed circuit boards, signal integrity, contour integral method, reciprocity theorem, time domain

Klíčová slova v angličtině

printed circuit boards, signal integrity, contour integral method, reciprocity theorem, time domain

Autoři

ŠTUMPF, M.

Rok RIV

2015

Vydáno

25.03.2014

Nakladatel

IEEE Press

ISSN

0018-9375

Periodikum

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

Svazek

56

Číslo

2

Stát

Spojené státy americké

Strany od

367

Strany do

374

Strany počet

8

URL

BibTex

@article{BUT101999,
  author="Martin {Štumpf}",
  title="The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits",
  journal="IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY",
  year="2014",
  volume="56",
  number="2",
  pages="367--374",
  doi="10.1109/TEMC.2013.2280297",
  issn="0018-9375",
  url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6600836"
}