Detail publikačního výsledku
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
ŠTUMPF, M.
Originální název
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
Anglický název
The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits
Druh
Článek WoS
Originální abstrakt
The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.
Anglický abstrakt
The time-domain counterpart of Okoshi's contour integral method is formulated with the aid of the reciprocity theorem of the time-convolution type. A numerical procedure for solving the time-domain reciprocity relation is proposed and validated using an analytical solution based on the eigenfunction expansion and the finite integration technique. For the former, the time-domain counterpart of the classical double-summation formula for a rectangular power-ground structure is found and evaluated.
Klíčová slova
printed circuit boards, signal integrity, contour integral method, reciprocity theorem, time domain
Klíčová slova v angličtině
printed circuit boards, signal integrity, contour integral method, reciprocity theorem, time domain
Autoři
ŠTUMPF, M.
Rok RIV
2015
Vydáno
25.03.2014
Nakladatel
IEEE Press
ISSN
0018-9375
Periodikum
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
Svazek
56
Číslo
2
Stát
Spojené státy americké
Strany od
367
Strany do
374
Strany počet
8
URL
BibTex
@article{BUT101999,
author="Martin {Štumpf}",
title="The Time-Domain Contour Integral Method - An Approach to the Analysis of Double-Plane Circuits",
journal="IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY",
year="2014",
volume="56",
number="2",
pages="367--374",
doi="10.1109/TEMC.2013.2280297",
issn="0018-9375",
url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6600836"
}